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VFY:T1313SC010IN

Toote nimetus: Fujitsu PRIMERGY TX1310 M3 server 3.3 GHz 8 GB Tower Intel® Xeon® E3 Family 250 W DDR4-SDRAM
EAN: 4053026551786
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624,67 € neto
749,60 € bruto
Saadavus:
11-20  tk.
Kättetoimetamine:
Tavaline kättetoimetamine:
esmaspäev, 12. juuli 2021
Kiire kättetoimetamine:
neljapäev, 8. juuli 2021
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Kirjeldus
Lugege veel Fujitsu PRIMERGY TX1310 M3 server 3.3 GHz 8 GB Tower Intel® Xeon® E3 Family 250 W DDR4-SDRAM
Spetsifikatsioon
Processor
The manufacturer that produced the processor.  Processor manufacturer Intel  
The model number for the processor in a computer.  Processor model E3-1225V6  
The speed that the microprocessor executes each instruction or each vibration of the clock. The CPU requires a fixed number of clock ticks, or cycles, to execute each instruction. The faster the clocks rate, the faster the CPU, or the faster it can execute instructions. Clock Speeds are usually determined in MHz, 1 MHz representing 1 million cycles per second, or in GHz, 1 GHz representing 1 thousand million cycles per second. The higher the CPU speed, the better a computer will perform.  Processor frequency 3.3 GHz  
The turbo boost is an automatic, managed accelleration of the processor when one of the cores is overloaded.  Processor boost frequency 3.7 GHz  
A family of processors is a group of processors produced by one company over a short period of time e.g. Intel Pentium processors.  Processor family Intel® Xeon® E3 Family  
The number of central processing units ('cores') in a processor. Some processors have 1 core, others have 2 (e.g. Intel Core Duo) or more (e.g. the Intel Xeon E7-2850 has 10 cores).  Processor cores 4  
Processor cache 8 MB  MB
The chipset connects the microprocessor to the rest of the motherboard.  Motherboard chipset Intel® C236  
Memory channels supported by processor Dual  
Number of processors in the product.  Number of processors installed 1  
Thermal Design Power (TDP) 95 W  
Processor cache type Smart Cache  
Mechanical component(s) that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the processor to be replaced without soldering.  Processor socket LGA 1155 (Socket H2)  
The process which is performed by the processor e.g. CPU (Central Processing Unit).  Processor lithography 32 nm  
Processor threads 4  
Operating modes for the processors that place restrictions on the type and scope of operations for certain processes run by the CPU. This design allows the operating system to run with more privileges than application software.  Processor operating modes 64-bit  
Stepping D2  
Bus type DMI  
Processor codename Sandy Bridge  
Tcase 72.6 °C  
Maximum internal memory supported by processor 32 GB  GB
Memory types supported by processor DDR3-SDRAM  
Memory clock speeds supported by processor 1066,1333 MHz  MHz
Memory bandwidth supported by processor (max) 21 GB/s  
ECC supported by processor Yes  
Execute Disable Bit Yes  
Idle States Yes  
Thermal Monitoring Technologies Yes  
Maximum number of PCI Express lanes 2  
Processor package size 37.5 mm  
Supported instruction sets AVX,SSE4.1,SSE4.2  
Processor code SR00G  
Embedded options available Yes  
CPU multiplier (bus/core ratio) 31  
Memory
A computer's memory which is directly accessible to the CPU.  Internal memory 8 GB  GB
The type of internal memory such as RAM, GDDR5.  Internal memory type DDR4-SDRAM  
Number and type of memory expansion slots, including connector and memory module descriptions.  Memory slots 4  
ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.  ECC Yes  
The frequency at which the memory (e.g. RAM) runs.  Memory clock speed 2400 MHz  MHz
The slots and size of the memory for the CPU.  Memory layout (slots x size) 1 x 8 GB  GB
The maximum internal memory which is available in the product.  Maximum internal memory 64 GB  GB
Storage
The total amount of data that can be stored on the device.  Total storage capacity 2000 GB  GB
The number of hard drives built into the device.  Number of HDDs installed 2  
The maximum storage capacity of the hard disk, usually measured in bytes e.g. GB.  HDD capacity 1000 GB  GB
The way that a hard disk drive (HDD) is connected to the rest of the computer through a 'bus' such as ATA or SCSI.  HDD interface Serial ATA III  
The rotational speed of a hard disk expressed in rotations per minute. The faster the better.  HDD speed 7200 RPM  
The amount of data that the hard drive can store.  HDD size 3.5"  "
The total number of hard drives that can be used in/with this product.  Number of HDDs supported 4  
The size of the hard disk drives which can be used by the device.  Supported HDD sizes 3.5"  "
The type of interface(s) with which the Solid State Drive is connected to other hardware.  SSD interface Serial ATA III  
The device uses RAID, which is a storage technology that combines multiple disk drive components into a logical unit for the purposes of data redundancy and performance improvement. Data is distributed across the drives in one of several ways, referred to as RAID levels, depending on the specific level of redundancy and performance required.  RAID support Yes  
RAID is a storage technology that combines multiple disk drive components into a logical unit for the purposes of data redundancy and performance improvement. Data is distributed across the drives in one of several ways, referred to as RAID levels, depending on the specific level of redundancy and performance required.  RAID levels 0,1,10  
Device has hot-plug capability, which means that user can replace system components without shutting down the system.  Hot-Plug support No  
An optical drive uses laser to read optical discs such as CDs, DVDs and Blu-Ray. Some types of optical drive are: CD ROM drive, CR-RW (CD writer) drive, DVD-ROM.  Optical drive type DVD-RW  
Supported storage drive interfaces Serial ATA III  
Graphics
Graphics hardware which is built into the motherboard or CPU, as opposed to a separate graphics adapter (video card). On-board graphics uses CPU and RAM for graphics processing.  On-board graphics adapter Yes  
Graphic adapter is the hardware that produces images on a display. "On-board" means that the graphics adapter is intergrated inside the motherboard.  On-board graphics adapter model Intel® HD Graphics P3000  
On-board graphics adapter family Intel® HD Graphics  
On-board graphics adapter base frequency 850 MHz  MHz
On-board graphics adapter dynamic frequency (max) 1350 MHz  MHz
Maximum on-board graphics adapter memory 1.7 GB  GB
On-board graphics adapter OpenGL version 4.4  
On-board graphics adapter DirectX version 12.0  
The feature may not be available on all computing systems. Functionality, performance, and other benefits of this feature may vary depending on system configuration.  Number of displays supported (on-board graphics) 2  
On-board graphics adapter ID 0x191D  
On-board graphics adapter 4K support Yes  
Network
LAN controller Intel® I219  
An Ethernet LAN (Local Area Network) interface is present, for a wired conection via a cable.  Ethernet LAN Yes  
Type of cable technology performance.  Cabling technology 10/100/1000Base-T(X)  
Ethernet interface type Gigabit Ethernet  
Ports & interfaces
Number of Ethernet LAN (RJ-45) ports (connecting interfaces) in the device. Ethernet LAN (RJ-45) ports allow a computer to connect to the ethernet.  Ethernet LAN (RJ-45) ports 1  
Number of USB 2.0 ports (connecting interfaces) in the device. USB 2.0 was released in April 2000 (now called "Hi-Speed"), adding higher maximum signaling rate of 480 Mbit/s (effective throughput up to 35 MB/s or 280 Mbit/s), USB 2.0 ports are usually black.  USB 2.0 ports quantity 3  
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity 6  
Number of DisplayPorts. A DisplayPort is a digital display interface developed by the Video Electronics Standards Association (VESA). The interface is primarily used to connect a video source to a display device such as a computer monitor, though it can also be used to carry audio, USB, and other forms of data.  DisplayPorts quantity 1  
Expansion slots
PCI Express x1 (Gen 3.x) slots 1  
PCI Express x4 (Gen 3.x) slots 1  
Places where PCI Express x16 (Gen 3.x) are placed inside and connected to the computer motherboard.  PCI Express x16 (Gen 3.x) slots 1  
PCI Express slots version 2.0  
Design
The type of rigid framework onto which is the hosuing for device components.  Chassis type Tower  
Performance
Trusted Platform Module (TPM) Yes  
Software
List of desktop operating systems tested as compatible with this product.  Compatible operating systems Microsoft Hyper-V Server 2012 R2 Microsoft Hyper-V Server 2016 Microsoft Windows Server 2012 R2 Datacenter Microsoft Windows Server 2016 Datacenter Microsoft Windows Server 2012 R2 Standard Microsoft Windows Server 2016 Standard Microsoft Windows Server 2012 R2 Essentials Microsoft Windows Server 2016 Essentials Microsoft Windows Server 2012 R2 Foundation Microsoft Windows Storage Server 2012 R2 Standard Microsoft Windows Storage Server 2016 Standard Microsoft Hyper-V Server 2012 Microsoft Windows Server 2012 Datacenter Microsoft Windows Server 2012 Standard Microsoft Windows Server 2012 Essentials Microsoft Windows Server 2012 Foundation SUSE Linux Enterprise Server 12 Red Hat Enterprise Linux 7  
Processor special features
CPU configuration (max) 1  
Enhanced Intel SpeedStep Technology Yes  
<b>Connect to TV Wirelessly</b> With a few clicks, Intel® Wireless Display expands your screen’s potential, linking mobile devices and laptops to TV screens wirelessly. Stream family favorites and view personal experiences while turning your device’s small screen into a superior, sharable experience.  Intel® Wireless Display (Intel® WiDi) No  
<b>Simplify Virtualization and Reduce Overheads</b> Intel® Virtualization Technology (Intel® VT) helps make virtualization practical by eliminating performance overheads, reducing complexity, and improving security with hardware assistance. Virtualization allows multiple workloads to share a common set of resources so that a variety of workloads can co-locate while maintaining full isolation from each other.  Intel Virtualization Technology for Directed I/O (VT-d) Yes  
<b>Improved Performance for Threaded Software</b> Intel® Hyper-Threading Technology (Intel® HT Technology) makes efficient use of processor resources, enabling multiple threads to run on each core and increasing processor throughput. Available on Intel® Core™ and Intel® Xeon® processors, Intel HT Technology helps run demanding applications simultaneously, protect and manage systems, and provide headroom for business growth.  Intel® Hyper Threading Technology (Intel® HT Technology) No  
<b>Higher Performance When You Need It Most</b> Intel® Turbo Boost Technology 2.0 accelerates processor and graphics performance by increasing the operating frequency when operating below specification limits. The maximum frequency varies depending on workload, hardware, software, and overall system configuration.  Intel® Turbo Boost Technology 2.0  
<b>Create, Edit, and Share Video in a Flash</b> Intel® Quick Sync Video uses the dedicated media processing capabilities of Intel® Graphics Technology to make video encoding tasks—such as creating DVDs or Blu-ray discs, creating and editing 3D videos, converting 2D video files into 3D, and converting video for portable media players and social networking sites—faster and easier.  Intel® Quick Sync Video Technology Yes  
Add a new dimension to your viewing experience. Now you can play games and watch your favorite 3D movies with Blu-ray Stereo 3D playback using passive or active shutter 3D glasses. InTru™ 3D technology by Intel in association with Dreamworks delivers it all in 1080p full high-definition resolution on your TV over HDMI 1.4.  Intel® InTru™ 3D Technology Yes  
<b>See the World More Vividly</b> Intel® Clear Video HD Technology delivers cleaner, sharper images, more natural, accurate, and vivid colors. View images as they were meant to be seen on devices featuring Intel® Core™ processors with Intel® Graphics Technology.  Intel® Clear Video HD Technology (Intel® CVT HD) Yes  
Intel Flex Memory Access Yes  
<b>Improve Responsiveness with Faster Data Access</b> With Intel® Smart Cache on the Intel® Core™ i5 processor, the shared cache is dynamically allocated to each processor core, based on workload. This efficient, dual-core-optimized implementation increases the probability that each core can access data from the fast cache, significantly reducing latency to frequently used data and improving performance.  Intel® Smart Cache Yes  
<b>Added Security with Faster Data Encryption</b> The Intel® Advanced Encryption Standard New Instructions (Intel® AES-NI) enable fast and secure data encryption and decryption for better performance and less risk from timing and cache-based attacks than table-based software implementations. Intel AES-NI supports usages such as standard key lengths, standard modes of operation, and even some nonstandard or future variants.  Intel® AES New Instructions (Intel® AES-NI) Yes  
Intel Trusted Execution Technology Yes  
Intel Enhanced Halt State Yes  
Intel VT-x with Extended Page Tables (EPT) Yes  
Intel Demand Based Switching Yes  
Intel 64 Yes  
Intel Identity Protection Technology version 1.00  
<b>Simplify Virtualization and Reduce Overheads</b> Intel® Virtualization Technology (Intel® VT) helps make virtualization practical by eliminating performance overheads, reducing complexity, and improving security with hardware assistance. Virtualization allows multiple workloads to share a common set of resources so that a variety of workloads can co-locate while maintaining full isolation from each other.  Intel Virtualization Technology (VT-x) Yes  
Intel Dual Display Capable Technology Yes  
Intel FDI Technology Yes  
Intel Fast Memory Access Yes  
Processor ARK ID 52270  
Power
The way in which the product is powered e.g. rechargeable battery, mains electricity connected via a plug and cable.  Power supply 250 W  
Additional power supply which can run a computer if the main power supply fails.  Redundant power supply (RPS) support No  
The quantity of main power supplies for this product.  Number of main power supplies 1  
The frequency of the electricity, usually measured in Hertz (Hz), which is supplied by the power supply. Mains electricity in many parts of the world is 50Hz.  Power supply input frequency 50 - 60 Hz  
Operational conditions
The minimum and maximum temperatures at which the product can be safely operated.  Operating temperature (T-T) 10 - 35 °C  
Certificates
Certification CB, RoHS, WEEE, GS, CE, CSA us, ULc/us, FCC Class A, VCCI:V3 Class A + JIS 61000-3-2, KC, CCC, C-Tick (AS / NZS CISPR 22 Class A)  
Weight & dimensions
The measurement or extent of something from side to side.  Width 180 mm  
The distance from the front to the back of something.  Depth 305 mm  
The measurement of the product from head to foot or from base to top.  Height 375 mm  
Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.  Weight 14 kg  
Technical details
Sustainability certificates EPEAT Gold  

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