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7X10A06QEA

Toote nimetus: Lenovo ThinkSystem ST550 server 3.4 GHz 32 GB Tower (4U) Intel® Xeon® Gold 750 W DDR4-SDRAM
EAN: -
Part number: 7X10A06QEA
8 414,06 € neto
10 096,87 € bruto
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Lugege veel Lenovo ThinkSystem ST550 server 3.4 GHz 32 GB Tower (4U) Intel® Xeon® Gold 750 W DDR4-SDRAM
Spetsifikatsioon
Processor
The manufacturer that produced the processor.  Processor manufacturer Intel  
The model number for the processor in a computer.  Processor model 6128  
The speed that the microprocessor executes each instruction or each vibration of the clock. The CPU requires a fixed number of clock ticks, or cycles, to execute each instruction. The faster the clocks rate, the faster the CPU, or the faster it can execute instructions. Clock Speeds are usually determined in MHz, 1 MHz representing 1 million cycles per second, or in GHz, 1 GHz representing 1 thousand million cycles per second. The higher the CPU speed, the better a computer will perform.  Processor frequency 3.4 GHz  
The turbo boost is an automatic, managed accelleration of the processor when one of the cores is overloaded.  Processor boost frequency 3.7 GHz  
A family of processors is a group of processors produced by one company over a short period of time e.g. Intel Pentium processors.  Processor family Intel® Xeon® Gold  
The number of central processing units ('cores') in a processor. Some processors have 1 core, others have 2 (e.g. Intel Core Duo) or more (e.g. the Intel Xeon E7-2850 has 10 cores).  Processor cores 6  
Processor cache 19.25 MB  MB
The chipset connects the microprocessor to the rest of the motherboard.  Motherboard chipset Intel® C624  
Number of processors in the product.  Number of processors installed 1  
Thermal Design Power (TDP) 115 W  
Processor cache type L3  
Mechanical component(s) that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the processor to be replaced without soldering.  Processor socket LGA 3647 (Socket P)  
The process which is performed by the processor e.g. CPU (Central Processing Unit).  Processor lithography 14 nm  
Processor threads 12  
Stepping H0  
Processor codename Skylake  
Tcase 74 °C  
Maximum internal memory supported by processor 768 GB  GB
Memory types supported by processor DDR4-SDRAM  
Memory clock speeds supported by processor 2666 MHz  MHz
Execute Disable Bit Yes  
Maximum number of PCI Express lanes 48  
Processor package size 76.0 x 56.5 mm  
Supported instruction sets AVX,AVX 2.0,AVX-512,SSE4.2  
Processor code SR3J4  
Scalability S4S  
Embedded options available No  
Conflict free means "DRC conflict free", which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries.  Conflict-Free processor Yes  
Memory
A computer's memory which is directly accessible to the CPU.  Internal memory 32 GB  GB
The type of internal memory such as RAM, GDDR5.  Internal memory type DDR4-SDRAM  
Number and type of memory expansion slots, including connector and memory module descriptions.  Memory slots 12  
ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.  ECC Yes  
The frequency at which the memory (e.g. RAM) runs.  Memory clock speed 2666 MHz  MHz
The slots and size of the memory for the CPU.  Memory layout (slots x size) 1 x 32 GB  GB
Storage
The device uses RAID, which is a storage technology that combines multiple disk drive components into a logical unit for the purposes of data redundancy and performance improvement. Data is distributed across the drives in one of several ways, referred to as RAID levels, depending on the specific level of redundancy and performance required.  RAID support Yes  
RAID is a storage technology that combines multiple disk drive components into a logical unit for the purposes of data redundancy and performance improvement. Data is distributed across the drives in one of several ways, referred to as RAID levels, depending on the specific level of redundancy and performance required.  RAID levels 0,1,5,6,10,50,60  
Supported RAID controllers 930-8i 2GB  
Graphics
Graphics hardware which is built into the motherboard or CPU, as opposed to a separate graphics adapter (video card). On-board graphics uses CPU and RAM for graphics processing.  On-board graphics card Yes  
Graphic adapter is the hardware that produces images on a display. "On-board" means that the graphics adapter is intergrated inside the motherboard.  On-board graphics card model Matrox G200  
Graphics memory is determined by the (graphic) processor. Graphics memory is often shared with system memory so that it varies depending on the amount of system memory installed and system load.  Maximum graphics card memory 16 MB  MB
Network
An Ethernet LAN (Local Area Network) interface is present, for a wired conection via a cable.  Ethernet LAN Yes  
Type of cable technology performance.  Cabling technology 10/100/1000Base-T(X)  
Ports & interfaces
Number of USB 2.0 ports (connecting interfaces) in the device. USB 2.0 was released in April 2000 (now called "Hi-Speed"), adding higher maximum signaling rate of 480 Mbit/s (effective throughput up to 35 MB/s or 280 Mbit/s), USB 2.0 ports are usually black.  USB 2.0 ports quantity 5  
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity 3  
Number of VGA (D-Sub) ports (connecting interfaces) in the device. The VGA (D-Sub) connector is a 15 pin connector between a computer and a monitor. It was first introduced in 1987 by IBM.  VGA (D-Sub) ports quantity 1  
Expansion slots
PCI Express slots version 3.0  
Design
The type of rigid framework onto which is the hosuing for device components.  Chassis type Tower (4U)  
The colour e.g. red, blue, green, black, white.  Product colour Black  
Redundant fans support Yes  
Performance
Performance management XClarity Standard  
Trusted Platform Module (TPM) Yes  
Trusted Platform Module (TPM) version 1.2  
Software
List of desktop operating systems tested as compatible with this product.  Compatible operating systems Microsoft Windows Server, Red Hat Enterprise Linux, SUSE Linux Enterprise Server, VMware ESXi  
Processor special features
Enhanced Intel SpeedStep Technology Yes  
<b>Simplify Virtualization and Reduce Overheads</b>
Intel® Virtualization Technology (Intel® VT) helps make virtualization practical by eliminating performance overheads, reducing complexity, and improving security with hardware assistance. Virtualization allows multiple workloads to share a common set of resources so that a variety of workloads can co-locate while maintaining full isolation from each other.  Intel Virtualization Technology for Directed I/O (VT-d) Yes  
<b>Improved Performance for Threaded Software</b>
Intel® Hyper-Threading Technology (Intel® HT Technology) makes efficient use of processor resources, enabling multiple threads to run on each core and increasing processor throughput. Available on Intel® Core™ and Intel® Xeon® processors, Intel HT Technology helps run demanding applications simultaneously, protect and manage systems, and provide headroom for business growth.  Intel® Hyper Threading Technology (Intel® HT Technology) Yes  
<b>Higher Performance When You Need It Most</b>
Intel® Turbo Boost Technology 2.0 accelerates processor and graphics performance by increasing the operating frequency when operating below specification limits. The maximum frequency varies depending on workload, hardware, software, and overall system configuration.  Intel® Turbo Boost Technology 2.0  
<b>Added Security with Faster Data Encryption</b>
The Intel® Advanced Encryption Standard New Instructions (Intel® AES-NI) enable fast and secure data encryption and decryption for better performance and less risk from timing and cache-based attacks than table-based software implementations. Intel AES-NI supports usages such as standard key lengths, standard modes of operation, and even some nonstandard or future variants.  Intel® AES New Instructions (Intel® AES-NI) Yes  
Intel Trusted Execution Technology Yes  
Intel VT-x with Extended Page Tables (EPT) Yes  
Intel TSX-NI Yes  
Intel 64 Yes  
<b>Simplify Virtualization and Reduce Overheads</b>
Intel® Virtualization Technology (Intel® VT) helps make virtualization practical by eliminating performance overheads, reducing complexity, and improving security with hardware assistance. Virtualization allows multiple workloads to share a common set of resources so that a variety of workloads can co-locate while maintaining full isolation from each other.  Intel Virtualization Technology (VT-x) Yes  
Intel TSX-NI version 1.00  
Processor ARK ID 120482  
Power
The way in which the product is powered e.g. rechargeable battery, mains electricity connected via a plug and cable.  Power supply 750 W  
Additional power supply which can run a computer if the main power supply fails.  Redundant power supply (RPS) support Yes  
Number of redundant power supplies installed 1  
Weight & dimensions
The measurement or extent of something from side to side.  Width 176 mm  
The distance from the front to the back of something.  Depth 660 mm  
The measurement of the product from head to foot or from base to top.  Height 438 mm  
Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.  Weight 36 kg  
Sustainability certificates ENERGY STAR  

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