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7X02A04KEA

Toote nimetus: Lenovo ThinkSystem SR630 server 61.44 TB 1.8 GHz 16 GB Rack (1U) Intel® Xeon® 750 W DDR4-SDRAM
EAN: 889488440177
Part number: 7X02A04KEA
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Lugege veel Lenovo ThinkSystem SR630 server 61.44 TB 1.8 GHz 16 GB Rack (1U) Intel® Xeon® 750 W DDR4-SDRAM
Spetsifikatsioon
Processor
The manufacturer that produced the processor.  Processor manufacturer Intel  
The model number for the processor in a computer.  Processor model 4108  
The speed that the microprocessor executes each instruction or each vibration of the clock. The CPU requires a fixed number of clock ticks, or cycles, to execute each instruction. The faster the clocks rate, the faster the CPU, or the faster it can execute instructions. Clock Speeds are usually determined in MHz, 1 MHz representing 1 million cycles per second, or in GHz, 1 GHz representing 1 thousand million cycles per second. The higher the CPU speed, the better a computer will perform.  Processor frequency 1.8 GHz  
The turbo boost is an automatic, managed accelleration of the processor when one of the cores is overloaded.  Processor boost frequency 3 GHz  
A family of processors is a group of processors produced by one company over a short period of time e.g. Intel Pentium processors.  Processor family Intel® Xeon®  
The number of central processing units ('cores') in a processor. Some processors have 1 core, others have 2 (e.g. Intel Core Duo) or more (e.g. the Intel Xeon E7-2850 has 10 cores).  Processor cores 8  
Processor cache 11 MB  MB
Memory channels supported by processor Hepta  
Number of processors in the product.  Number of processors installed 1  
Thermal Design Power (TDP) 85 W  
Processor cache type L3  
A processor which is compatible with this device, belongs to a 'series' which is part of 'family' e.g Celeron D, Celeron G, Celeron M, or, in some cases, is the same as 'family'.  Compatible processor series Intel® Xeon®  
Mechanical component(s) that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the processor to be replaced without soldering.  Processor socket LGA 3647 (Socket P)  
The process which is performed by the processor e.g. CPU (Central Processing Unit).  Processor lithography 14 nm  
Processor threads 16  
Operating modes for the processors that place restrictions on the type and scope of operations for certain processes run by the CPU. This design allows the operating system to run with more privileges than application software.  Processor operating modes 64-bit  
Stepping U0  
Number of QPI links 2  
Processor codename Skylake  
Tcase 77 °C  
Maximum internal memory supported by processor 768 GB  GB
Memory types supported by processor DDR4-SDRAM  
Memory clock speeds supported by processor 2400 MHz  MHz
ECC supported by processor Yes  
Execute Disable Bit Yes  
Maximum number of PCI Express lanes 48  
Processor package size 76.0 x 56.5 mm  
Supported instruction sets AVX,AVX 2.0,AVX-512,SSE4.2  
Processor code SR3GJ  
Scalability 2S  
Embedded options available No  
Conflict free means "DRC conflict free", which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries.  Conflict-Free processor Yes  
Memory
A computer's memory which is directly accessible to the CPU.  Internal memory 16 GB  GB
The type of internal memory such as RAM, GDDR5.  Internal memory type DDR4-SDRAM  
Number and type of memory expansion slots, including connector and memory module descriptions.  Memory slots 24  
ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.  ECC Yes  
The frequency at which the memory (e.g. RAM) runs.  Memory clock speed 2666 MHz  MHz
The slots and size of the memory for the CPU.  Memory layout (slots x size) 1 x 16 GB  GB
The maximum internal memory which is available in the product.  Maximum internal memory 1536 GB  GB
Storage
The maximum amount of data that can be stored in the device.  Maximum storage capacity 61.44 TB  
The way that a hard disk drive (HDD) is connected to the rest of the computer through a 'bus' such as ATA or SCSI.  HDD interface Serial ATA, Serial Attached SCSI (SAS)  
The amount of data that the hard drive can store.  HDD size 2.5"  "
The total number of hard drives that can be used in/with this product.  Number of HDDs supported 8  
The size of the hard disk drives which can be used by the device.  Supported HDD sizes 2.5"  "
Number of SSDs supported 8  
The device uses RAID, which is a storage technology that combines multiple disk drive components into a logical unit for the purposes of data redundancy and performance improvement. Data is distributed across the drives in one of several ways, referred to as RAID levels, depending on the specific level of redundancy and performance required.  RAID support Yes  
RAID is a storage technology that combines multiple disk drive components into a logical unit for the purposes of data redundancy and performance improvement. Data is distributed across the drives in one of several ways, referred to as RAID levels, depending on the specific level of redundancy and performance required.  RAID levels 0,1,5,6,10,50,60  
Supported RAID controllers 930-8i  
Device has hot-plug capability, which means that user can replace system components without shutting down the system.  Hot-Plug support Yes  
Hot-swap Yes  
An optical drive uses laser to read optical discs such as CDs, DVDs and Blu-Ray. Some types of optical drive are: CD ROM drive, CR-RW (CD writer) drive, DVD-ROM.  Optical drive type No  
Graphics
Graphics hardware which is built into the motherboard or CPU, as opposed to a separate graphics adapter (video card). On-board graphics uses CPU and RAM for graphics processing.  On-board graphics card Yes  
Graphic adapter is the hardware that produces images on a display. "On-board" means that the graphics adapter is intergrated inside the motherboard.  On-board graphics card model Matrox G200  
Network
An Ethernet LAN (Local Area Network) interface is present, for a wired conection via a cable.  Ethernet LAN Yes  
Type of cable technology performance.  Cabling technology 10/100/1000Base-T(X)  
Ports & interfaces
Number of USB 2.0 ports (connecting interfaces) in the device. USB 2.0 was released in April 2000 (now called "Hi-Speed"), adding higher maximum signaling rate of 480 Mbit/s (effective throughput up to 35 MB/s or 280 Mbit/s), USB 2.0 ports are usually black.  USB 2.0 ports quantity 1  
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity 3  
Number of VGA (D-Sub) ports (connecting interfaces) in the device. The VGA (D-Sub) connector is a 15 pin connector between a computer and a monitor. It was first introduced in 1987 by IBM.  VGA (D-Sub) ports quantity 2  
Expansion slots
Slots in the computer for PCI Express x8 (Gen 3.x), which is a high-speed serial computer expansion bus standard with 8 pins.  PCI Express x8 (Gen 3.x) slots 2  
Places where PCI Express x16 (Gen 3.x) are placed inside and connected to the computer motherboard.  PCI Express x16 (Gen 3.x) slots 1  
PCI Express slots version 3.0  
Design
The type of rigid framework onto which is the hosuing for device components.  Chassis type Rack (1U)  
The type of mounting that can position devices in a shelving system (rack).  Rack mounting Yes  
Redundant fans support Yes  
Rack rails Yes  
Performance
Performance management XClarity Enterprise  
Trusted Platform Module (TPM) Yes  
Trusted Platform Module (TPM) version 1.2  
Software
List of desktop operating systems tested as compatible with this product.  Compatible operating systems Microsoft Windows Server 2016/2012 R2 Red Hat Enterprise Linux 7.3/6.9 SUSE Linux Enterprise Server 12 SP2/11 SP4 VMware vSphere (ESXi) 6.5/6.0 U3  
Processor special features
Enhanced Intel SpeedStep Technology Yes  
<b>Simplify Virtualization and Reduce Overheads</b> Intel® Virtualization Technology (Intel® VT) helps make virtualization practical by eliminating performance overheads, reducing complexity, and improving security with hardware assistance. Virtualization allows multiple workloads to share a common set of resources so that a variety of workloads can co-locate while maintaining full isolation from each other.  Intel Virtualization Technology for Directed I/O (VT-d) Yes  
<b>Improved Performance for Threaded Software</b> Intel® Hyper-Threading Technology (Intel® HT Technology) makes efficient use of processor resources, enabling multiple threads to run on each core and increasing processor throughput. Available on Intel® Core™ and Intel® Xeon® processors, Intel HT Technology helps run demanding applications simultaneously, protect and manage systems, and provide headroom for business growth.  Intel® Hyper Threading Technology (Intel® HT Technology) Yes  
<b>Higher Performance When You Need It Most</b> Intel® Turbo Boost Technology 2.0 accelerates processor and graphics performance by increasing the operating frequency when operating below specification limits. The maximum frequency varies depending on workload, hardware, software, and overall system configuration.  Intel® Turbo Boost Technology 2.0  
<b>Added Security with Faster Data Encryption</b> The Intel® Advanced Encryption Standard New Instructions (Intel® AES-NI) enable fast and secure data encryption and decryption for better performance and less risk from timing and cache-based attacks than table-based software implementations. Intel AES-NI supports usages such as standard key lengths, standard modes of operation, and even some nonstandard or future variants.  Intel® AES New Instructions (Intel® AES-NI) Yes  
Intel Trusted Execution Technology Yes  
Intel VT-x with Extended Page Tables (EPT) Yes  
Intel TSX-NI Yes  
Intel 64 Yes  
<b>Simplify Virtualization and Reduce Overheads</b> Intel® Virtualization Technology (Intel® VT) helps make virtualization practical by eliminating performance overheads, reducing complexity, and improving security with hardware assistance. Virtualization allows multiple workloads to share a common set of resources so that a variety of workloads can co-locate while maintaining full isolation from each other.  Intel Virtualization Technology (VT-x) Yes  
Intel TSX-NI version 1.00  
Processor ARK ID 123544  
Power
The way in which the product is powered e.g. rechargeable battery, mains electricity connected via a plug and cable.  Power supply 750 W  
Additional power supply which can run a computer if the main power supply fails.  Redundant power supply (RPS) support Yes  
Number of redundant power supplies supported 2  
The frequency of the electricity, usually measured in Hertz (Hz), which is supplied by the power supply. Mains electricity in many parts of the world is 50Hz.  Power supply input frequency 50 - 60 Hz  
Operational conditions
The minimum and maximum temperatures at which the product can be safely operated.  Operating temperature (T-T) 5 - 45 °C  
The minimum and maximum temperatures at which the product can be safely stored.  Storage temperature (T-T) -10 - 60 °C  
Operating relative humidity (H-H) 8 - 90%  
Storage relative humidity (H-H) 8 - 90%  
Operating altitude 0 - 3048 m  
Weight & dimensions
The measurement or extent of something from side to side.  Width 482 mm  
The distance from the front to the back of something.  Depth 778.3 mm  
The measurement of the product from head to foot or from base to top.  Height 43 mm  
Sustainability certificates ENERGY STAR  
Other features
Conflict free means "DRC conflict free", which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries.  Conflict-Free Yes  

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