Meie veebipood kasutab küpsiseid. Selle poe külastamisel nõustute lubama meil salvestada ja kasutada küpsiseid. Rohkem teavet võib leida Privaatsuspoliitikast ja informatsioonist küpsiste kohta
OK
Eesti (muutke)
0
Päring
0,00 €
0
Ostukorvi
0,00 €
Laadimine...
Laadimine...
Päringut ja tellimust on värskendatud!
Päringut ja tellimust on värskendatud! Päringut ja tellimust on värskendatud!
Toode on otsas.
Vabandame, kuid toode pole laos.

3MC16EA#AKD

Toote nimetus: HP Z4 G4 DDR4-SDRAM i9-7900X Mini Tower Intel® Core™ i7 X-series 16 GB 512 GB SSD Windows 10 Pro Workstation Black (3MC16EA)
EAN: 192545486415
Part number: 3MC16EA#AKD
3MC16EA#AKD Photo#1 3MC16EA#AKD Photo#2 3MC16EA#AKD Photo#3 3MC16EA#AKD Photo#4 3MC16EA#AKD Photo#5 3MC16EA#AKD Photo#6 3MC16EA#AKD Photo#7 3MC16EA#AKD Photo#8
3MC16EA#AKD Photo#1
3MC16EA#AKD Photo#2
3MC16EA#AKD Photo#3
3MC16EA#AKD Photo#4
3MC16EA#AKD Photo#5
3MC16EA#AKD Photo#6
3MC16EA#AKD Photo#7
3MC16EA#AKD Photo#8
3 027,00 € neto
3 632,40 € bruto
Puudub laos
Ideaalsed lahendused teie ettevõttele
Me leiame teie ettevõtte jaoks optimaalse lahenduse. Meie müügi- ja eelmüügispetsialistid valivad iga päev klientidele tooteid ja teenuseid.
Seadmete ekspresstarned kogu maailmas
Me garanteerime teie seadmete õigeaegse kohaletoimetamise, kus iganes te ka ei viibiks. Teeme koostööd ülemaailmsete partneritega, et tagada optimaalne logistika.
Rakendustoetus garanteeritud
Me pakume tuge lahenduste rakendamisel teie ettevõttes. Meie kvalifitseeritud insenerid aitavad teil oma infrastruktuuri tõhusalt hallata.
Klient kõigepealt
Meie RMA-eksperdid tegelevad kaebuste ja seadmete asendamisega kiiresti ja tõhusalt, et teie äri saaks sujuvalt toimida.
Kirjeldus
Lugege veel HP Z4 G4 DDR4-SDRAM i9-7900X Mini Tower Intel® Core™ i7 X-series 16 GB 512 GB SSD Windows 10 Pro Workstation Black (3MC16EA)
Spetsifikatsioon
Processor
The manufacturer that produced the processor.  Processor manufacturer Intel  
The model number for the processor in a computer.  Processor model i9-7900X  
A family of processors is a group of processors produced by one company over a short period of time e.g. Intel Pentium processors.  Processor family Intel® Core™ i7 X-series  
The number of central processing units ('cores') in a processor. Some processors have 1 core, others have 2 (e.g. Intel Core Duo) or more (e.g. the Intel Xeon E7-2850 has 10 cores).  Processor cores 10  
The turbo boost is an automatic, managed accelleration of the processor when one of the cores is overloaded.  Processor boost frequency 4.5 GHz  
The speed that the microprocessor executes each instruction or each vibration of the clock. The CPU requires a fixed number of clock ticks, or cycles, to execute each instruction. The faster the clocks rate, the faster the CPU, or the faster it can execute instructions. Clock Speeds are usually determined in MHz, 1 MHz representing 1 million cycles per second, or in GHz, 1 GHz representing 1 thousand million cycles per second. The higher the CPU speed, the better a computer will perform.  Processor frequency 3.3 GHz  
Mechanical component(s) that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the processor to be replaced without soldering.  Processor socket LGA 2066 (Socket R4)  
Processor cache 13.75 MB  MB
Processor cache type L3  
Processor threads 20  
A bus is a communication system that transfers data between components inside a computer, or between computers. The system bus rate is the speed at which data is transferred in this communication system.  System bus rate 8 GT/s  GT/s
Bus type DMI3  
The process which is performed by the processor e.g. CPU (Central Processing Unit).  Processor lithography 14 nm  
Operating modes for the processors that place restrictions on the type and scope of operations for certain processes run by the CPU. This design allows the operating system to run with more privileges than application software.  Processor operating modes 64-bit  
Thermal Design Power (TDP) 140 W  
Processor codename Skylake  
Tjunction 95 °C  
PCI Express slots version 3.0  
Maximum number of PCI Express lanes 44  
Number of processors in the product.  Number of processors installed 1  
Stepping U0  
Maximum internal memory supported by processor 128 GB  GB
Memory types supported by processor DDR4-SDRAM  
Memory clock speeds supported by processor 2666 MHz  MHz
ECC supported by processor No  
Memory
The type of internal memory such as RAM, GDDR5.  Internal memory type DDR4-SDRAM  
A computer's memory which is directly accessible to the CPU.  Internal memory 16 GB  GB
The maximum internal memory which is available in the product.  Maximum internal memory 256 GB  GB
The slots and size of the memory for the CPU.  Memory layout (slots x size) 2 x 8 GB  GB
Number and type of memory expansion slots, including connector and memory module descriptions.  Memory slots 8x DIMM  
The frequency at which the memory (e.g. RAM) runs.  Memory clock speed 2666 MHz  MHz
ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.  ECC No  
Non-ECC Yes  
Memory channels Quad-channel  
Storage
The total amount of data that can be stored on the device.  Total storage capacity 512 GB  GB
Used for the storage of date e.g. HDD (hard disk drive), SSD (solid-state drive).  Storage media SSD  
An optical drive uses laser to read optical discs such as CDs, DVDs and Blu-Ray. Some types of optical drive are: CD ROM drive, CR-RW (CD writer) drive, DVD-ROM.  Optical drive type DVD-RW  
Amount of storage drives built into the device.  Number of storage drives installed 1  
Total SSDs capacity 512 GB  GB
Number of SSDs installed 1  
The Solid State Drive's data storage capacity.  SSD capacity 512 GB  GB
The type of interface(s) with which the Solid State Drive is connected to other hardware.  SSD interface SATA III  
RAID is a storage technology that combines multiple disk drive components into a logical unit for the purposes of data redundancy and performance improvement. Data is distributed across the drives in one of several ways, referred to as RAID levels, depending on the specific level of redundancy and performance required.  RAID levels 0,1,5,10  
Graphics
Discrete graphics card No  
A graphics adapter (often known as a video card) generates images for a display. A discrete graphics adapter plugs into the motherboard, and usually produces much better graphics than an integrated graphics adapter. There are various models of discrete graphics adapters.  Discrete graphics card model Not available  
Graphics hardware which is built into the motherboard or CPU, as opposed to a separate graphics adapter (video card). On-board graphics uses CPU and RAM for graphics processing.  On-board graphics card No  
Graphic adapter is the hardware that produces images on a display. "On-board" means that the graphics adapter is intergrated inside the motherboard.  On-board graphics card model Not available  
Network
An Ethernet LAN (Local Area Network) interface is present, for a wired conection via a cable.  Ethernet LAN Yes  
The different speed levels of the Ethernet LAN connection.  Ethernet LAN data rates 10,100,1000 Mbit/s  Mbit/s
Type of cable technology performance.  Cabling technology 10/100/1000Base-T(X)  
Ports & interfaces
Digital Visual Interface (DVI) is a video display interface to connect a video source to a display device, such as a computer monitor.  DVI port No  
The number of PS/2 connectors for keyboards and mice. Its name comes from the IBM Personal System/2.  PS/2 ports quantity 2  
Number of Ethernet LAN (RJ-45) ports (connecting interfaces) in the device. Ethernet LAN (RJ-45) ports allow a computer to connect to the ethernet.  Ethernet LAN (RJ-45) ports 1  
The socket where a microphone is connected to the device.  Microphone in No  
Line-in Yes  
Line-out Yes  
Combo headphone/mic port Yes  
Design
The type of rigid framework onto which is the hosuing for device components.  Chassis type Mini Tower  
Where the product can be placed e.g. indoor/outdoor, horizontal/vertical.  Placement supported Vertical  
A drive bay is a standard-area for adding hardware to a computer. Most drive bays are fixed to the inside of a case, but some can be removed. A 3.5" drive bay is for floppy disks.  Number of 3.5" bays 2  
A drive bay is a standard-area for adding hardware to a computer. Most drive bays are fixed to the inside of a case, but some can be removed. A 5.25" drive bay, also known as full-height bays, were found in old PCs in the early to mid-1980s. They were 3¼″ high by 5¾″ wide, and up to 8″ deep (83 × 146 × 200 mm), used mainly for hard disks and floppy disk drives.  Number of 5.25" bays 2  
Holes on the edge of devices through which a cable lock can be passed, so the device can be locked to a desk etc.  Cable lock slot Yes  
Cable lock slot type Kensington  
The colour e.g. red, blue, green, black, white.  Product colour Black  
Country where the device is made. Aka Country of manufacture (COM).  Country of origin China  
Performance
Audio chip Realtek ALC221  
The sub-category of the product.  Product type Workstation  
Software
Type of operating system on a device e.g. IOS on Apple devices, Android for mobile devices.  Operating system installed Windows 10 Pro  
The way in which the operating system of a computer/smartphone (32-bit/64-bit) is set up.  Operating system architecture 64-bit  
Processor special features
Supported instruction sets AVX 2.0,AVX-512,SSE4.1,SSE4.2  
Processor code SR3L2  
<b>Added Security with Faster Data Encryption</b> The Intel® Advanced Encryption Standard New Instructions (Intel® AES-NI) enable fast and secure data encryption and decryption for better performance and less risk from timing and cache-based attacks than table-based software implementations. Intel AES-NI supports usages such as standard key lengths, standard modes of operation, and even some nonstandard or future variants.  Intel® AES New Instructions (Intel® AES-NI) Yes  
Enhanced Intel SpeedStep Technology Yes  
Execute Disable Bit Yes  
Scalability 1S  
CPU configuration (max) 1  
Embedded options available No  
Intel Reference Heat Sink specification for proper operation of this SKU.  Thermal solution specification PCG 2017X  
Intel 64 Yes  
<b>Simplify Virtualization and Reduce Overheads</b> Intel® Virtualization Technology (Intel® VT) helps make virtualization practical by eliminating performance overheads, reducing complexity, and improving security with hardware assistance. Virtualization allows multiple workloads to share a common set of resources so that a variety of workloads can co-locate while maintaining full isolation from each other.  Intel Virtualization Technology for Directed I/O (VT-d) Yes  
<b>Simplify Virtualization and Reduce Overheads</b> Intel® Virtualization Technology (Intel® VT) helps make virtualization practical by eliminating performance overheads, reducing complexity, and improving security with hardware assistance. Virtualization allows multiple workloads to share a common set of resources so that a variety of workloads can co-locate while maintaining full isolation from each other.  Intel Virtualization Technology (VT-x) Yes  
Processor ARK ID 123613  
<b>Higher Performance When You Need It Most</b> Intel® Turbo Boost Technology 2.0 accelerates processor and graphics performance by increasing the operating frequency when operating below specification limits. The maximum frequency varies depending on workload, hardware, software, and overall system configuration.  Intel® Turbo Boost Technology 2.0  
<b>Improved Performance for Threaded Software</b> Intel® Hyper-Threading Technology (Intel® HT Technology) makes efficient use of processor resources, enabling multiple threads to run on each core and increasing processor throughput. Available on Intel® Core™ and Intel® Xeon® processors, Intel HT Technology helps run demanding applications simultaneously, protect and manage systems, and provide headroom for business growth.  Intel® Hyper Threading Technology (Intel® HT Technology) Yes  
Conflict free means "DRC conflict free", which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries.  Conflict-Free processor Yes  
Brand-specific features
HP Software provided HP Remote Graphics Software, HP Performance Advisor  
HP segment Business  
Power
The way in which the product is powered e.g. rechargeable battery, mains electricity connected via a plug and cable.  Power supply 1000 W  
Weight & dimensions
The measurement or extent of something from side to side.  Width 169 mm  
The distance from the front to the back of something.  Depth 445 mm  
The measurement of the product from head to foot or from base to top.  Height 386 mm  
Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.  Weight 10.2 kg  
Packaging content
This product includes a display.  Display included No  
Other features
The number of optical drives e.g. CD players/writers, DVD players/writers.  Optical drives quantity 1  

Valitud tooted
Hoidke meiega ühendust!
Liituge meie uudiskirjaga ning olge meie sooduspakkumiste ja uudistega kursis.

Klõpsates "telli" nupul, nõustute turundusteabe saatmisega oma meiliaadressile. Teie isikuandmeid haldab Senetic AB oma registrisse kantud aadressiga Östermalmstorg 1, 114 42 Stockholm, Sverige. Teil on õigus nõuda juurdepääsu isikuandmetele ning parandada, kustutada või piirata nende töötlemist ning esitada vastuväiteid andmete töötlemise kohta. Üksikasjalikku teavet isikuandmete töötlemise kohta leiate privaatsuseeskirjadest.

Vale e-maili aadress.
See e-maili aadress on juba kinnitatud.
See e-maili aadress on veel kinnitamata.
Aitäh!
Kontrollige oma postkasti - saate meilt kirja, mille kaudu peate uudiskirja tellimuse kinnitama.
Partnerlused
Makseviisid
Tarneviisid
Sertifikaadid ja tunnustused